Sigma Designs announced its new SMP8674 media processor, which is intended for hybrid IPTV Set-Top Boxes (STBs), OTT streaming players and WiDi and Wi-Fi display receivers.
Sharp and Semiconductor Energy Laboratory announced that the companies have jointly developed a new oxide semiconductor (IGZO) display technology for mobile device displays.
Intel Corporation announced its new 3rd generation Core microprocessor family, which employs company’s 22nm 3-D tri-Gate transistor technology.
Tensilica announced that it has added support for the Dynamic Resolution Adaptation (DRA) standard to its HiFi Audio digital signal processors (DSPs).
Southern Products (Sigmac USA) announced that it has signed an agreement to integrate LCD and LED flat panels from LG Electronics into Sigmac televisions.
IHS iSuppli announced that, according to its latest teardown analysis, Apple’s iPad (32GB + 4G) tablet costs the company $375.10 in materials and labour to produce.
Renesas Electronics announced its new R-Home S1 System-on-Chip (SoC), which is designed for hybrid Set-Top Boxes (STBs).
The U.S. Department of Justice (DOJ) announced that a federal jury in San Francisco found AU Optronics guilty of participating in a conspiracy to fix the prices of Thin-film Transistor (TFT) Liquid Crystal Display (LCD) panels.
Tensilica announced that VIA Technologies has selected Tensilica’s Xtensa dataplane processors (DPUs) for a system-on-chip (SOC) design for solid state drives (SSDs).
IHS iSuppli announced it reckons that prices for large-sized Liquid Crystal Display (LCD) panels stabilized in December 2011.
IHS iSuppli announced it expects the global electronics contract manufacturing business to decline slightly in 2012.
NPD DisplaySearch announced that it has increased its forecast for LCD TV area demand to 85 million square meters in 2012, nearly 2% higher than its previous estimate.
Rovi Corporation announced that Amlogic has introduced a DivX Plus HD certified chipset for Android.
Corning Incorporated announced its new Gorilla Glass 2 damage-resistant cover glass for consumer electronic devices at CES 2012.
SENSIO Technologies announced that a 3DTV semiconductor manufacturer has licensed the company’s Hi-Fi 3D decoding technology.