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Archive of posts filed under the Components and Materials category.

Amlogic Unveils Android DivX Plus HD Certified Chipset

Rovi Corporation announced that Amlogic has introduced a DivX Plus HD certified chipset for Android.

Corning Rolls Out Gorilla Glass 2

Corning Incorporated announced its new Gorilla Glass 2 damage-resistant cover glass for consumer electronic devices at CES 2012.

SENSIO Licenses Hi-Fi 3D Decoding Technology

SENSIO Technologies announced that a 3DTV semiconductor manufacturer has licensed the company’s Hi-Fi 3D decoding technology.

OLED Display Technology Moving to Compete

NPD DisplaySearch announced it forecasts that Organic Light Emitting Diode (OLED) display revenues will rise from $4 billion in 2011 to more than $20 billion (roughly 16% of the total display industry) by 2018.

Wistron Blu-ray Media Hubs Go With ViXS

ViXS Systems announced that the latest Blu-ray Disc (BD) media hubs from Wistron employ ViXS’ XCode 4210 System on Chip (SoC).

Tensilica Goes Whole Hog at CES 2012

Tensilica announced that it will showcase its latest technology for digital televisions, Blu-ray Disc (BD) players, 4G handsets and data cards at CES 2012.

Lite-On µ-Play Goes With ViXS

ViXS Systems announced that Lite-On’s new μ-Play streaming media gateway employs ViXS’ XCode 4210 System on Chip (SoC).

Sony Sells Stake in LCD Panel JV to Samsung

Sony Corporation announced that it will sell its stake in its LCD panel manufacturing joint venture to Samsung Electronics.

Projected Capacitive Touch Screens Go Mainstream

NPD DisplaySearch announced it forecasts that over 566 million Projected Capacitive Touch (PCT) screens will ship for mobile phone application in 2011.

LTPS and IGZO Production for LCD Displays Skyrockets

NPD DisplaySearch announced it forecasts that Low-Temperature Polysilicon (LTPS) and Indium Gallium Zinc Oxide (IGZO) production for LCD displays will increase 150% in 2012.