Unedited press release follows:
DTS and HiSilicon Announce First Silicon Platform to Offer Complete Audio Solution for High-Definition Audio Consumption for Mobile Devices
Leading Chipset Solution Provider Integrates DTS-HD® Decoder and DTS Ultra Mobile™ Solution to Enhance Mobile Audio Experience
CALABASAS, Calif. — DTS, Inc. (Nasdaq: DTSI), a leader in high-definition audio solutions, today announced collaboration with HiSilicon—a leading chipset solution provider for wireless phones, telecom networks, and digital media. Under the agreement, HiSilicon will integrate the new DTS-HD® decoder and DTS Ultra Mobile™ audio solution into the HiSilicon K3V2 Application Processor family, delivering a superior end-to-end audio solution for mobile platforms. This HiSilicon platform, coupled with a DTS-HD decoder and DTS Ultra Mobile post-processing technologies, provides an immersive and more engaging audio experience for on-the-go consumers.
“Our collaboration with HiSilicon enables broad access to high-quality audio for all mobile consumers,” said Brian Towne, executive vice president and chief operating officer of DTS, Inc.
DTS-HD decoder enables consumers to playback any DTS encoded music or movie content, from bandwidth efficient low bit-rates to pristine lossless audio, including content encoded in DTS’s widely adopted DTS-HD Master Audio™, the audio technology of choice for more than 86%* of Blu-ray™ titles. DTS Ultra Mobile provides a multi-dimensional entertainment experience for mobile phones by enhancing audio with a dramatic, expansive sound field and surround sound effect. DTS Ultra Mobile also dramatically raises the perceived loudness of audio playback while preserving the integrity of the original content. This technology enhances smartphones by maximizing the power of smaller speakers without clipping or distorting audio when listening to music, playing games, and enjoying video content.
“Stemming from our longtime strategic partnership, our relationship with HiSilicon marks a significant milestone in our continued commitment to integrate DTS audio enhancement solutions into the ever-expanding number of today’s consumer digital media devices,” commented Roy Law, president of DTS Greater China Region.
HiSilicon Technologies Co., Ltd. is a leading chipset solution provider for telecom network, wireless terminal and digital media. HiSilicon has the advantage to provide end-to-end chipsets and solutions from telecom network to consumer electronics. It has been serving more than 200 global operators in over 100 countries and will continue to bring maximum value to global operators and consumers. For more information, please visit www.hisilicon.com
About DTS, Inc.
DTS, Inc. (Nasdaq: DTSI) is dedicated to making digital entertainment exciting, engaging and effortless by providing state-of-the-art audio technology to hundreds of millions of DTS-licensed consumer electronics products worldwide. From a renowned legacy as a pioneer in multi-channel audio, DTS became a mandatory audio format in the Blu-ray Disc™ standard and is now increasingly deployed in enabling digital delivery of movies and other forms of digital entertainment on a growing array of network-connected consumer devices. DTS technology is in home theaters, car audio systems, PCs, game consoles, DVD players, televisions, digital media players, set-top boxes, smart phones, surround music software and every device capable of playing Blu-ray™ discs. Founded in 1993, DTS’ corporate headquarters are located in Calabasas, California with its licensing operations headquartered in Limerick, Ireland. DTS also has offices in Northern California, Washington, China, France, Hong Kong, Japan, South Korea, Taiwan, Singapore, and the United Kingdom. For further information, please visit www.dts.com.