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Archive of posts tagged System-on-Chip (SoC)

SENSIO Inks Autodetect Integration Deal

SENSIO Technologies announced that it has licensed its SENSIO Autodetect technology to a major manufacturer of 3DTV semiconductors.

MediaTek Embraces DivX Plus Streaming

Rovi Corporation announced that MediaTek plans to integrate Rovi’s DivX Plus Streaming technology into its System-on-Chip (SoC) offerings for connected Blu-ray Disc (BD) players and TVs.

Panasonic to Integrate DivX Plus Streaming

Rovi Corporation announced that Panasonic will incorporate DivX Plus Streaming technology into is UniPhier series of integrated circuits for digital televisions and Blu-ray Disc (BD) players.

DTV Manufacturers Adopt Sigma HiDTV SoC

Sigma Designs announced that its HiDTV Fusion SmartTV System-on-Chip (SoC) is being welcomed with open arms by major European TV manufacturers.

Sigma Chipset Powers VIZIO Cinemawide Smart TVs

Sigma Designs announced that VIZIO’s new 21:9 Cinemawide HDTVs will incorporate Sigma’s HiDTV Pro Connected TV chipset.

MStar Adopts DivX Plus Streaming

Rovi Corporation announced that MStar Semiconductor plans to integrate DivX Plus Streaming technology into its System-on-Chip (SoC) platforms for Smart Digital TVs.

Sigma Designs Launches Media Player SoC

Sigma Designs announced its new SMP8674 media processor, which is intended for hybrid IPTV Set-Top Boxes (STBs), OTT streaming players and WiDi and Wi-Fi display receivers.

Renesas Launches SoC for Hybrid Set-Top Boxes

Renesas Electronics announced its new R-Home S1 System-on-Chip (SoC), which is designed for hybrid Set-Top Boxes (STBs).

SENSIO Licenses Hi-Fi 3D Decoding Technology

SENSIO Technologies announced that a 3DTV semiconductor manufacturer has licensed the company’s Hi-Fi 3D decoding technology.

Lite-On µ-Play Goes With ViXS

ViXS Systems announced that Lite-On’s new μ-Play streaming media gateway employs ViXS’ XCode 4210 System on Chip (SoC).

Marvell Integrates SENSIO Hi-Fi 3D

Sensio Technologies Inc. announced that Marvell Technology has integrated Sensio’s Hi-Fi 3D technology into the company’s newest 3DTVs chipset.

ViXS Launches Blu-ray and PVR Reference Design

ViXS Systems announced its new turnkey hardware and software Blu-ray PVR Reference Design for consumer electronics manufacturers.

LG DTVs Go with Tensilica

Tensilica announced that LG Electronics has selected the company’s HiFi Audio DSP core and several audio codecs for LG’s new line of digital televisions (DTVs).

Trident Powers China Next Generation Broadcasting

Trident Microsystems announced that its Set-top Box (STB) System-on-Chips (SoCs) are being tapped for one of the first trial deployments of Next Generation Broadcasting (NGB) in China.

Zoran SoCs Add Sensio Hi-Fi 3D

Sensio Technologies announced that Zoran will integrate Sensio Hi-Fi 3D decoding technology into new Zoran System-on-Chip (SoC) products for 3D-capable televisions and Set-Top Boxes (STBs).