For more information visit: www.tensilica.com
Unedited press release follows:
VIA Chooses Tensilica for Solid State Drive (SSD) Chip Design
Over 4x Higher Performance Than Competing Processors
TAIPEI, TAIWAN and SANTA CLARA, CA–(Feb 15, 2012) – Tensilica®, Inc. today announced that VIA has selected Tensilica’s Xtensa® dataplane processors (DPUs) for a system-on-chip (SOC) design for solid state drives (SSDs). After conducting a technical evaluation, VIA determined that Tensilica’s DPUs provide over four times the performance of competing processors on key algorithms used to benchmark competitive alternatives.
SSDs require faster and more efficient data management and manipulation to increase their throughput (measured in Input/Output Operations per Second, or IOPS). With conventional processors, increasing the clock speed is the common way to increase performance. However, this increases energy consumption and die size, especially as speeds increase so much that designers are forced to move to more complex multi-core solutions.
Tensilica’s DPUs allow designers to customize the IP core, mix both control and signal processing, and add high-bandwidth connectivity to increase performance without increasing the clock speed. For example, designers can use single-cycle bit field manipulation and arithmetic instructions along with multiple simultaneous single-cycle table lookups to achieve over 10 times the efficiency of other processors. This not only increases IOPS, but also significantly reduces the energy consumed and the complexity of the SOC design itself.
“In the SSD market, every competitive advantage we can get is very important,” stated Jiin Lai, VIA’s CTO. “We have a significant advantage using Tensilica DPUs to lower the power and increase the throughput of our products.”
“VIA is a great example of how our customers benefit from high performance, low energy consumption, and small die size with Tensilica DPUs that have full software and hardware development paths which simplifies integration with existing RTL and software,” stated Steve Roddy, Tensilica’s vice president of marketing and business development.
About VIA Technologies, Inc.
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards.
Headquartered in Taipei, Taiwan, VIA’s global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world’s top OEMs and system integrators. VIA is registered on the Taiwan Stock Exchange (TSE 2388). Visit www.via.com.tw.
Tensilica, Inc. is the leader in dataplane processor IP cores. Dataplane processors (DPUs) are a superset of DSPs and CPUs that can scale from tiny micro signal processors to programmable offload accelerators and powerful DSPs. DPUs deliver 10 to 100x the performance because they can be optimized using Tensilica’s automated design tools to meet specific and demanding signal processing performance and efficiency targets. Tensilica’s DPUs power SOC designs at many Tier 1 system OEMs and seven out of the top 10 semiconductor companies for designs in mobile wireless, telecom and network infrastructure, computing and storage, and home and auto entertainment. For more information on Tensilica’s patented, benchmark-proven DPUs visit www.tensilica.com.